Thermal - Heat Sinks
- Attachment Method：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Filter：
173 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 2.7W... |
1,923
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
15,288
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 6.8W... |
1,393
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
3,205
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 14 ... |
3,326
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1,287
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1,713
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
2,893
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1,689
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
5,589
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
2,208
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1,944
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1,433
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1,262
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1,250
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
35,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1,774
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
2,121
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
2,000
In-stock
|
Get Quote |
