HSS23-B20-NP

Mfr.Part #
HSS23-B20-NP
Manufacturer
CUI Devices
Package/Case
-
Datasheet
Download
Description
HEAT SINK, STAMPING, TO-218/TO-2
Stock
2657

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Manufacturer :
CUI Devices
Product Category :
Thermal - Heat Sinks
Attachment Method :
Bolt On
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
TO-218, TO-220
Power Dissipation @ Temperature Rise :
7.36W @ 75°C
Product Status :
Active
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
5.00°C/W @ 200 LFM
Thermal Resistance @ Natural :
10.19°C/W
Type :
Top Mount
Datasheets
HSS23-B20-NP

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