HSS25-B20-P51

Mfr.Part #
HSS25-B20-P51
Manufacturer
CUI Devices
Package/Case
-
Datasheet
Download
Description
HEAT SINK, STAMPING, TO-218/TO-2
Stock
35000

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Manufacturer :
CUI Devices
Product Category :
Thermal - Heat Sinks
Attachment Method :
PC Pin
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
TO-218, TO-220
Power Dissipation @ Temperature Rise :
5.88W @ 75°C
Product Status :
Active
Shape :
Square, Fins
Thermal Resistance @ Forced Air Flow :
6.30°C/W @ 200 LFM
Thermal Resistance @ Natural :
12.75°C/W
Type :
Board Level
Datasheets
HSS25-B20-P51

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