HSE-B18635-0396H

Mfr.Part #
HSE-B18635-0396H
Manufacturer
CUI Devices
Package/Case
-
Datasheet
Download
Description
HEAT SINK, EXTRUSION, TO-218, 63
Stock
35000

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Manufacturer :
CUI Devices
Product Category :
Thermal - Heat Sinks
Attachment Method :
Bolt On and PC Pin
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
TO-218
Power Dissipation @ Temperature Rise :
13.7W @ 75°C
Product Status :
Active
Shape :
Rectangular, Angled Fins
Thermal Resistance @ Forced Air Flow :
2.78°C/W @ 200 LFM
Thermal Resistance @ Natural :
5.47°C/W
Type :
Board Level, Vertical
Datasheets
HSE-B18635-0396H

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